PRIVACY POLICY

Rigid PCB Capability

Item

Standard

Advance

Layers

1-20 layers

22-64 layers

HDI

1+N+1&2+N+2&3+N+3

Any layer interconnection

Finger(Au)

1-30U”

30-50U”

Max Panel Size

520*800mm

800*1200mm

Min Panel Size

5*5mm

5*5mm

Board Thickness

0.1mm-4.0mm

4.0mm-7.0mm

Min Half  Hole/Slot

0.5mm

0.3mm

Min. Line Width/Space

3mil/3mil

2mil/2mil

Min. Hole Size

0.1mm

0.075mm

Inner Copper Thickness

0.5-4oz

0.5-10oz

Outer Copper Thickness

0.5-6oz

0.5-15oz or more

Tolerance

Line Width

±10%

±5%

PTH Hole Size

±0.075mm

±0.05mm

NPTH Hole Size

± 0.05mm

±0.025mm

Hole Position

±0.05mm

±0.025mm

Outline

±0.1mm

±0.05mm

Board Thickness

±10%

±5%

Impedance Control

±10%

±5%

Bow and Twist

0.75%

0.50%

Board Material

FR-4, CEM-3, Rogers, High TG,High Speed,High Frequency ,High Thermal Conductivity

Surface Finish

HASL(with Pb free), Plated Ni/Au, ENIG, Immersion Tin, Immersion Ag, OSP,etc.

Solder Mask

White, Black, Blue, Green, Grey, Red,Yellow, Transparent 

Legend Color

White, Black, Yellow etc.

Certification

UL, IATF16949, ISO, RoHs&Reach